- Part Number XCZU3CG-L1SFVA625I
- Manufacturer Xilinx
- Description IC FPGA 180 I/O 625FCBGA
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Lead Free / RoHS
Part Number
XCZU3CG-L1SFVA625I
Manufacturer
Xilinx
Description
IC FPGA 180 I/O 625FCBGA
Lead Free / RoHS
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Specification
| RAM Size: | 256KB |
|---|---|
| Package / Case: | 625-BFBGA, FCBGA |
| Packaging: | Tray |
| Supplier Device Package: | 625-FCBGA (21x21) |
| Number of I/O: | 180 |
| Speed: | 500MHz, 1.2GHz |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Detailed Description: | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 154K+ Logic Cells 256KB 500MHz, 1.2GHz 625-FCBGA (21x21) |
| Flash Size: | - |
| Connectivity: | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Moisture Sensitivity Level (MSL): | 4 (72 Hours) |
| Manufacturer Standard Lead Time: | 10 Weeks |
| Core Processor: | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Primary Attributes: | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
| Series: | Zynq® UltraScale+™ MPSoC CG |
| Architecture: | MCU, FPGA |
| Operating Temperature: | -40°C ~ 100°C (TJ) |
| Peripherals: | DMA, WDT |