XCZU3EG-L2SFVC784E

XCZU3EG-L2SFVC784E

  • Part Number XCZU3EG-L2SFVC784E
  • Manufacturer Xilinx
  • Description IC FPGA 252 I/O 784FCBGA
  • Lead Free / RoHS
    lead rohs
Part Number

XCZU3EG-L2SFVC784E

Manufacturer

Xilinx

Description

IC FPGA 252 I/O 784FCBGA

Lead Free / RoHS
lead rohs
Stock & Pricing
Stock 300 60 1 Action
in stock $762.18 $793.48 $824.78
  • Stock in stock
  • 300
    $762.18
  • 60
    $793.48
  • 1
    $824.78
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Specification
RAM Size: 256KB
Package / Case: 784-BBGA, FCBGA
Packaging: Tray
Supplier Device Package: 784-FCBGA (23x23)
Number of I/O: 252
Speed: 533MHz, 600MHz, 1.3GHz
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Detailed Description: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 154K+ Logic Cells 256KB 533MHz, 600MHz, 1.3GHz 784-FCBGA (23x23)
Flash Size: -
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Moisture Sensitivity Level (MSL): 4 (72 Hours)
Manufacturer Standard Lead Time: 10 Weeks
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Series: Zynq® UltraScale+™ MPSoC EG
Architecture: MCU, FPGA
Operating Temperature: 0°C ~ 100°C (TJ)
Peripherals: DMA, WDT